This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009
Title: The Innovative Mind of Suk-Chun Jung
Introduction
Suk-Chun Jung, hailing from Cheonan-si, South Korea, is an esteemed inventor at Samsung Electronics Co., Ltd. With a strong background in electrical engineering, he has made significant contributions to the field of automated wire bonding. His pioneering work has led to the creation of a patented system that enhances the efficiency and accuracy of wire bonding processes.
Latest Patents
Suk-Chun Jung holds a patent for a "System and Method for Automated Wire Bonding." This innovative solution features a bonder viewer system that automates the identification of bonding sequences by utilizing data from a drawing management system. The invention includes several key components: a bonding sequence decision unit, a turning point check unit, and a bonding simulation unit. These elements work together to optimize the bonding process for integrated circuits (ICs), ensuring that the wire bonder's operations are precise and effective.
Career Highlights
At Samsung Electronics Co., Ltd., Suk-Chun Jung has been instrumental in advancing the company's capabilities in wire bonding technologies. His experience and expertise have enabled the development of solutions that streamline production processes and improve the reliability of electronic components. His work exemplifies the innovative spirit that drives modern technology forward.
Collaborations
Throughout his career, Suk-Chun Jung has collaborated with talented individuals such as Byung-Soo Kim and Kook-Jin Oh. Together, they have leveraged their collective knowledge and skills to push the boundaries of wire bonding technology, contributing to ongoing advancements within the industry.
Conclusion
Suk-Chun Jung's dedication to innovation in automated wire bonding reflects his commitment to enhancing technological processes in the electronics sector. His patented system serves as a testament to his ingenuity and the collaborative efforts of his peers, exemplifying the impact of skilled inventors in the ever-evolving world of technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile