This inventor holds 1 USPTO granted patent. Top assignees: Kyushu Electronic Metal Co., Ltd., Osaka Titanium Co., Ltd.. Active years: 1991.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 7 
1 out of 19 Years Active: 1991
Title: Biography of Inventor Sueo Sakata
Introduction: Sueo Sakata is a notable inventor based in Kishima, Japan. He is recognized for his contributions to the field of semiconductor technology, particularly in the production of semiconductor wafers.
Latest Patents: Sueo Sakata holds a patent for a method of producing semiconductor wafers through gettering. This innovative method involves sand blasting abrasives against the back surface of the semiconductor wafer, generating shear stress within the wafer and causing damage primarily in its interior.
Career Highlights: Throughout his career, Sakata has worked with prominent companies in the semiconductor industry, including Kyushu Electronic Metal Co., Ltd. and Osaka Titanium Co., Ltd. His work has significantly impacted the fabrication processes used in semiconductor manufacturing.
Collaborations: Sakata has collaborated with esteemed colleagues such as Yasunori Oka and Toshio Naritomi. These partnerships have contributed to advancements in semiconductor technologies and methodologies.
Conclusion: Sueo Sakata's innovative approach to semiconductor wafer production exemplifies the importance of creativity and collaboration in the field of technology. His contributions continue to influence the semiconductor industry today.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile