Subhash Rewachand Nariani

Title: Subhash Rewachand Nariani: Innovator in Chip Scale Packaging

Introduction

Subhash Rewachand Nariani is a notable inventor based in Pleasanton, CA (US). He has made significant contributions to the field of semiconductor packaging, particularly in the development of innovative chip scale packages. With a total of 2 patents to his name, Nariani continues to push the boundaries of technology.

Latest Patents

Nariani's latest patents focus on the wafer-level chip scale package. This innovative chip scale package utilizes solder bars to establish a connection between a chip and a trace, which is formed in a substrate, such as another chip or PCB. The solder bars are created by depositing one or more solder layers into the socket. Alternatively, a base metal layer can be deposited into the socket, followed by the application of the solder layer to the base metal layer. The geometry of the solder bars can be rectangular, square, or take on other regular or irregular shapes. This design enhances the utilization of the connectivity footprint and significantly increases both electrical and thermal flow capacity. Additionally, solder bars provide a robust connection, ensuring reliability in various applications.

Career Highlights

Nariani is currently associated with Volterra Semiconductor Corporation, where he applies his expertise in semiconductor technology. His work has been instrumental in advancing the capabilities of chip packaging solutions.

Collaborations

Throughout his career, Nariani has collaborated with talented professionals, including Efren M Lacap and Charles Nickel. These collaborations have contributed to the successful development of innovative technologies in the semiconductor industry.

Conclusion

Subhash Rewachand Nariani is a distinguished inventor whose work in chip scale packaging has made a significant impact on the semiconductor field. His innovative patents and collaborations continue to shape the future of technology.