Su-Yu Fang

Title: Innovations by Su-Yu Fang in Tape Automated Bonding Technology

Introduction

Su-Yu Fang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology, particularly in the area of tape automated bonding. With a total of 3 patents to his name, Fang's work focuses on improving the reliability and efficiency of bonding processes in semiconductor manufacturing.

Latest Patents

Fang's latest patents include innovative methods that enhance the tape automated bonding process. One of his key inventions is a method for tape automated bonding to composite bumps. This process involves bonding a tape-carrier through its finger leads to composite bumps on an integrated circuit (IC) chip. The composite bumps are constructed from a polymeric material layer and at least one metal layer. This design reduces structural damages during the bonding process, which are often caused by rigid metal bumps. The bonding process can be executed using various types of lead frames, including all-metal, plated metal, or polymer reinforced metal lead frames.

Another significant patent is the composite bump tape automated bonded structure. This invention provides a method for joining a lead array to the conducting bonding pads of an IC element. It utilizes an anisotropic conductive film with tape automated bonding to create a bonded structure. The composite bumps in this invention consist of a polymer body covered by a conductive metal coating. This method offers a low-cost solution for tape automated bonding, requiring lower temperature and pressure during the bonding process, which enhances the dimensional stability of the bonded elements.

Career Highlights

Su-Yu Fang is affiliated with the Industrial Technology Research Institute, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing bonding techniques that improve the performance and reliability of integrated circuits.

Collaborations

Fang has collaborated with several talented individuals in his field, including Pao-Yun Tang and Shyh-Ming Chang. These collaborations have contributed to the development of his innovative patents and have fostered a productive research environment.

Conclusion

Su-Yu Fang's contributions to tape automated bonding technology demonstrate his commitment to enhancing semiconductor manufacturing processes. His innovative patents reflect a deep understanding of material properties and bonding techniques, paving the way for more reliable integrated circuits.