Company Filing History:
Years Active: 1997
Title: Innovations by Steven P Laverde
Introduction
Steven P Laverde is an accomplished inventor based in Dallas, Texas. He is known for his innovative contributions to the field of semiconductor packaging. His work has significantly impacted the efficiency and effectiveness of electronic devices.
Latest Patents
Laverde holds a patent for a "Downset exposed die mount pad leadframe and package." This invention features a single piece deep downset exposed lead frame that can be utilized in current production processes. The design includes a die mount pad formed with a downset or cavity, allowing for the semiconductor die to be mounted securely. The wings of the lead frame lock the die pad in the device package and enhance the moisture path length. This innovative design provides direct thermal contact of the die mount pad to an external heat sink, eliminating the need for an internal heat slug. Additionally, the exposed die pad can serve as an RF ground connection to an RF circuit ground plane.
Career Highlights
Laverde is associated with Texas Instruments Corporation, a leading company in the semiconductor industry. His work at Texas Instruments has allowed him to contribute to various advancements in electronic components and systems.
Collaborations
Some of Laverde's notable coworkers include Buford H Carter, Jr and Dennis D Davis. Their collaboration has fostered an environment of innovation and creativity within the company.
Conclusion
Steven P Laverde's contributions to semiconductor technology exemplify the spirit of innovation. His patent for the downset exposed die mount pad leadframe showcases his ability to enhance electronic device performance. His work continues to influence the industry positively.