Gordonsville, VA, United States of America

Steven J Warakomski

USPTO Granted Patents = 2 

Average Co-Inventor Count = 1.5

ph-index = 1


Company Filing History:


Years Active: 2013-2024

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2 patents (USPTO):Explore Patents

Title: Innovations by Steven J Warakomski

Introduction

Steven J Warakomski is an accomplished inventor based in Gordonsville, VA (US). He holds two patents that showcase his expertise in developing advanced packaging materials. His work primarily focuses on creating multi-layered film laminates that enhance the functionality and durability of blister packaging.

Latest Patents

Warakomski's latest patents include a "Hot fill laminate" and a "Configuration of multiple thermoformable film layers for rigid packaging requiring moisture and oxygen protection." The hot fill laminate is a multi-layered film designed for making hot filled blister packages. It features a central core layer of barrier polymer film, which is sandwiched between a slip film and a thermostable film. This innovative laminate provides a high moisture barrier and a stable inter-laminar structure, making it suitable for hot filling liquids used in soft and gummy dosages. The second patent describes a four-layer film for packaging, which includes a moisture barrier and an oxygen barrier, ensuring the contents are protected from external moisture and preserving their effectiveness.

Career Highlights

Warakomski has worked with notable companies such as Klöckner Pentaplast of America, Inc. His experience in the packaging industry has significantly contributed to his innovative approach to film laminates.

Collaborations

Throughout his career, Warakomski has collaborated with professionals like Rachel Rimeikiene and James Warren Davis. These collaborations have likely enriched his work and led to further advancements in packaging technology.

Conclusion

Steven J Warakomski's contributions to the field of packaging through his innovative patents demonstrate his commitment to enhancing product safety and efficiency. His work continues to influence the industry and pave the way for future advancements in packaging solutions.

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