Company Filing History:
Years Active: 1991-1994
Title: The Innovative Contributions of Steven G Smith
Introduction
Steven G Smith is a notable inventor based in Linglestown, PA (US). He has made significant contributions to the field of electrical connectors, holding a total of 3 patents. His work reflects a commitment to advancing technology and improving the functionality of electronic components.
Latest Patents
One of his latest patents is the "Stacked Connector Assembly." This invention includes two connectors attached to a bracket, which is in turn affixed to the surface of a printed circuit board. The bracket is of unitary construction and features two side members interconnected by two lateral members. Openings in the bracket allow solder tails of the two connectors to extend, with surface portions that mount to both the connectors and the printed circuit board.
Another significant patent is the "Shielded Surface Mount Electrical Connector with Integral Barbed Board." This invention features an insulative housing that secures at least one compliant surface mount contact. The shield includes at least one integral boardlock, which has a spring designed for reception in a boardlock receiving aperture on a circuit board. The spring is equipped with a barb positioned to engage the wall of the receiving aperture, enhancing the connector's stability.
Career Highlights
Throughout his career, Steven G Smith has worked with reputable companies such as Amp LLC and The Whitaker Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
Steven has collaborated with notable coworkers, including Henry B Collins and Benjamin H Mosser, III. These partnerships have fostered a creative environment that has led to the development of groundbreaking inventions.
Conclusion
Steven G Smith's contributions to the field of electrical connectors demonstrate his innovative spirit and dedication to technology. His patents reflect a deep understanding of engineering principles and a commitment to enhancing electronic components.