Company Filing History:
Years Active: 2002-2003
Title: The Innovative Contributions of Stephen M Phillips
Introduction
Stephen M Phillips is a notable inventor based in Chesterland, OH (US). He has made significant contributions to the field of materials science, particularly in the development of multi-layer assemblies of polysilicon thin films. With a total of 2 patents, his work has implications for various applications in microstructures and electronics.
Latest Patents
Phillips' latest patents include innovative techniques for producing multi-layer assemblies with predetermined stress profiles. One of his patents focuses on multi-layer assemblies of polysilicon thin films that can achieve a stress level of zero or substantially so. This is accomplished by combining thin films with tensile and compressive stresses, allowing them to be placed adjacent to one another without intermediate layers. Additionally, these assemblies can exhibit selectively determinable overall bending moments, enabling the manufacture of microstructures with diverse geometrical configurations.
Career Highlights
Stephen M Phillips is affiliated with Case Western Reserve University, where he continues to advance research in materials science. His work has garnered attention for its potential to revolutionize the production of microstructures, which are essential in various technological applications.
Collaborations
Phillips has collaborated with esteemed colleagues such as Arthur H Heuer and Harold Kahn. Their combined expertise has contributed to the advancement of innovative materials and techniques in the field.
Conclusion
Stephen M Phillips stands out as a significant figure in the realm of materials science, with his patents paving the way for advancements in microstructure manufacturing. His innovative approaches to polysilicon thin films demonstrate the potential for future developments in this critical area of technology.