Company Filing History:
Years Active: 1989-2009
Title: Innovations of Stephen A. Demchock
Introduction
Stephen A. Demchock is a notable inventor based in Rochester, NY (US). He has made significant contributions to the field of technology, particularly through his work at Xerox Corporation. With a total of 5 patents to his name, Demchock has developed innovative solutions that address specific challenges in handling non-uniform thickness objects.
Latest Patents
Demchock's latest patents include a "Tray for Non-Uniform Thickness Objects" and a "Leveling Device for Removing Valleys in Stacked Objects." The tray patent discloses techniques for supporting objects in a tray and moving different portions of the objects at varying rates for inputting or outputting from an object's processor. This innovation is particularly useful for stacking objects with varying thicknesses, allowing for efficient handling and processing. The leveling device patent assists in supporting stackable objects, such as DocuCards, in a stackable tray. It features a pivoting tray that can transition between full and empty positions, along with a valley removal mechanism that compensates for uneven stacking caused by non-uniform thickness.
Career Highlights
Throughout his career, Demchock has been instrumental in advancing technologies at Xerox Corporation. His work has not only contributed to the company's innovation portfolio but has also enhanced the efficiency of processes involving non-uniform objects. His patents reflect a deep understanding of the challenges faced in this area and a commitment to finding practical solutions.
Collaborations
Demchock has collaborated with notable colleagues, including Raymond D. Wilcox and Richard A. Van Dongen. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Stephen A. Demchock's contributions to the field of technology through his patents and work at Xerox Corporation highlight his role as a significant inventor. His innovative solutions for handling non-uniform thickness objects demonstrate his expertise and commitment to advancing technology.