Berlin, Germany

Stefan Weib


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 1999

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Stefan Weib

Introduction

Stefan Weib is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of chip technology, particularly through his innovative patent that addresses the connection of high-power chips to heat sinks. His work is recognized for its potential to enhance the efficiency and performance of electronic devices.

Latest Patents

Stefan Weib holds a patent for a "Chip arrangement and method of producing the same." This invention involves a chip arrangement that includes a first chip, a connecting device, and at least a second chip or substrate. The connecting device features a plurality of individual, spaced diamond parts that connect the chips or the chip and substrate exclusively through these diamond parts. The methods for producing this chip arrangement include applying a diamond layer over the substrate and structuring it to define individual diamond parts or applying individual diamond parts directly to the chips or substrate.

Career Highlights

Stefan Weib is associated with the Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V., a leading research organization in Germany. His work at this institution has allowed him to focus on advanced technologies and contribute to the development of innovative solutions in the field of electronics.

Collaborations

Stefan has collaborated with esteemed colleagues such as Manfred Topfer and Eberhard Kaulfersch. These collaborations have further enriched his research and development efforts, leading to advancements in chip technology.

Conclusion

Stefan Weib's contributions to the field of chip technology through his innovative patent demonstrate his commitment to advancing electronic solutions. His work continues to influence the industry and pave the way for future innovations.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…