Company Filing History:
1 out of 5 
1 out of 832,912 Years Active: 2002-2004
Title: Innovations by Stanley Lai
Introduction
Stanley Lai is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative spirit and technical expertise.
Latest Patents
One of his latest inventions is an apparatus for attaching resists and wafers to substrates. This invention includes several components such as first and second moving devices for moving substrates and wafers, a tank for containing an adhesive agent, and a dispensing device that dispenses a predetermined amount of adhesive at the central region of the wafer. The apparatus also features a compressing device to eliminate air bubbles between the substrate and the wafer, ensuring a strong bond. Another notable patent is a leaded semiconductor device package designed for nonsoldering assembly. This package allows for the leads of a semiconductor device to be flattened, cut, and bent by automatic machines, enabling electrical connections without the need for soldering.
Career Highlights
Stanley has worked with General Semiconductor of Taiwan, Ltd., where he honed his skills in semiconductor packaging and technology. His experience in this field has allowed him to develop innovative solutions that improve manufacturing processes.
Collaborations
Throughout his career, Stanley has collaborated with notable individuals such as William John Nelson and Larry Shen. These collaborations have contributed to the advancement of technology in the semiconductor industry.
Conclusion
Stanley Lai's contributions to the field of semiconductor technology through his patents and career achievements highlight his role as an influential inventor. His innovative solutions continue to impact the industry positively.