Company Filing History:
Years Active: 2021-2023
Title: Srikanth Kulkarni: Innovator in Integrated Circuit Packaging
Introduction
Srikanth Kulkarni is a notable inventor based in San Diego, CA, who has made significant contributions to the field of integrated circuit packaging. With a total of 2 patents, he has developed innovative solutions that enhance the functionality and efficiency of integrated circuits.
Latest Patents
Kulkarni's latest patents include "Selective mold placement on integrated circuit (IC) packages and methods of fabricating" and "Structure for arrayed partial molding of packages." The first patent focuses on a customizable approach to applying mold material over circuits and other elements in IC packages. This innovation allows for the strategic placement of input/output (I/O) pads, enhancing the design flexibility of the metallization structure. The second patent introduces techniques for partially molding packages, which includes a substrate with mold barriers that prevent encapsulant movement, ensuring the integrity of the packaged assembly.
Career Highlights
Kulkarni is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work at Qualcomm has positioned him at the forefront of technological advancements in integrated circuits.
Collaborations
Throughout his career, Kulkarni has collaborated with talented professionals such as Sayok Chattopadhyay and Rajneesh Kumar, contributing to the development of innovative technologies in the field.
Conclusion
Srikanth Kulkarni's contributions to integrated circuit packaging through his patents reflect his commitment to innovation and excellence in technology. His work continues to influence the industry and pave the way for future advancements.