Sou Himori

Title: Sou Himori - Innovator in Adhesive Technology

Introduction

Sou Himori is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of adhesive technology, particularly with his innovative adhesive tape design. His work is characterized by a focus on enhancing the performance and durability of adhesive products.

Latest Patents

Sou Himori holds a patent for an advanced adhesive tape. This adhesive tape is designed to minimize delamination, even when the laminate layer is thin. The invention features a base material made of a warp-knitted fabric, which incorporates a weft yarn into a loop structure formed by multifilament warp yarns. The first laminate layer is formed on one surface of the base material, where one warp yarn is visible on the surface of the weft yarn. The second laminate layer is created on the opposite surface, showcasing two warp yarns on the weft yarn surface. Additionally, an adhesive layer is applied to the side of the first laminate layer, enhancing the tape's overall functionality.

Career Highlights

Sou Himori is currently employed at Teraoka Seisakusho Co., Ltd., where he continues to develop innovative adhesive solutions. His work at the company has positioned him as a key player in the adhesive technology sector.

Collaborations

Sou collaborates with Mikio Hosoi, a fellow innovator in the field. Their partnership has fostered a creative environment that encourages the development of cutting-edge adhesive products.

Conclusion

Sou Himori's contributions to adhesive technology, particularly through his patented adhesive tape, demonstrate his commitment to innovation and quality. His work continues to influence the industry and improve the performance of adhesive products.