Company Filing History:
Years Active: 2023
Title: Innovations of Soonwon Lee in Substrate Debonding Technology
Introduction
Soonwon Lee is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of substrate debonding technology. His innovative approach has led to the development of a unique apparatus that enhances the efficiency of separating substrates in various applications.
Latest Patents
Soonwon Lee holds 1 patent for his invention titled "Substrate Debonding Apparatus." This apparatus is designed to separate a support substrate attached to a device substrate by an adhesive layer. The key components of this invention include a substrate chuck that supports the device substrate, a light irradiator that directs light into the adhesive layer, and a mask that features an opening for exposing the support substrate. Additionally, the apparatus incorporates cooling passages to manage temperature during the debonding process.
Career Highlights
Soonwon Lee is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate and contribute to advancements in technology. His work is instrumental in improving manufacturing processes and enhancing product quality in the electronics industry.
Collaborations
He has collaborated with talented coworkers such as Ilyoung Han and Kyoungran Kim, contributing to a dynamic team environment that fosters innovation and creativity.
Conclusion
Soonwon Lee's contributions to substrate debonding technology exemplify the impact of innovative thinking in the electronics sector. His patent reflects a commitment to advancing manufacturing techniques and improving product performance.