Company Filing History:
Years Active: 1999
Title: Soichi Honma: Innovator in Semiconductor Technology
Introduction
Soichi Honma is a notable inventor based in Yamato, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the efficiency and reliability of semiconductor devices.
Latest Patents
Honma's latest patents include a semiconductor device with improved encapsulating resin. This innovative device comprises a wiring circuit board and a semiconductor chip mounted through a bump electrode on the circuit board. The design encapsulates the space between the circuit board and the semiconductor chip, as well as the periphery of the semiconductor chip, with a resin containing a filler. The resin is uniquely structured, featuring a first resin in regions surrounded by bump electrodes and a second resin in areas not surrounded by these electrodes. The first and second resins differ in at least one characteristic, such as content, maximum particle diameter, and average particle diameter of the filler.
Career Highlights
Soichi Honma is associated with Kabushiki Kaisha Toshiba, a leading company in the technology sector. His work at Toshiba has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.
Collaborations
Honma has collaborated with notable coworkers, including Hiroshi Yamada and Takasi Togasaki. Their combined expertise has fostered innovation and development in semiconductor devices.
Conclusion
Soichi Honma's contributions to semiconductor technology exemplify the spirit of innovation. His patents reflect a commitment to enhancing device performance and reliability. His work continues to influence the industry and inspire future advancements.