Hsinchu, Taiwan

Siu-Ming Yuen

USPTO Granted Patents = 2 

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2011-2013

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2 patents (USPTO):Explore Patents

Title: Siu-Ming Yuen: Innovator in Electromagnetic Interference Shielding

Introduction

Siu-Ming Yuen is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of composites with electromagnetic interference shielding effectiveness. With a total of 2 patents, his work is recognized for its innovative approach to enhancing material properties.

Latest Patents

One of Siu-Ming Yuen's latest patents is a method for preparing a multi-walled carbon nanotube (MWCNT) and polymer composite that exhibits electromagnetic interference (EMI) shielding effectiveness. This method involves dispersing MWCNTs in an organic solvent, such as N,N-Dimethylacetamide (DMAc). Monomers like methyl methacrylate (MMA) and an initiator, 2,2-azobisisobutyronitrile (AIBN), are then dissolved in the MWCNT dispersion. The polymerization of these monomers occurs at an elevated temperature, around 120°C, resulting in a MWCNT/PMMA composite. This composite can be coated onto a PET film, which can be utilized as an EMI shielding material, either alone or in a stack of multiple coated films.

Career Highlights

Siu-Ming Yuen is affiliated with Tsinghua University, where he continues to advance research in composite materials. His innovative methods have the potential to impact various industries that require effective EMI shielding solutions.

Collaborations

He has collaborated with notable colleagues, including Chen-Chi Martin Ma and Chia-Yi Chuang, contributing to a dynamic research environment that fosters innovation.

Conclusion

Siu-Ming Yuen's work in developing advanced composites for electromagnetic interference shielding showcases his expertise and commitment to innovation in materials science. His contributions are paving the way for new applications in technology and engineering.

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