Siew Kong Wong

Title: Innovations by Siew Kong Wong in Semiconductor Technology

Introduction

Siew Kong Wong is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He has developed a significant patent that addresses a common issue in the manufacturing of semiconductor packages.

Latest Patents

Wong holds a patent for a "Method and apparatus for reducing warpage in semiconductor packages." This invention specifically targets thin quad flat packages (TQFPs). The apparatus consists of a clamping jig with a bottom plate connected to a heater, which heats the plate to approximately 50 to 70 degrees Celsius. An air supply controller is utilized to deliver air to the upper plate. The TQFPs are placed between the bottom and upper plates immediately after being encapsulated with resin and after the resin has cured. The clamping jig applies a slight force to clamp the TQFPs until they have sufficiently cooled, effectively reducing warpage.

Career Highlights

Siew Kong Wong is currently employed at Advanced Systems Automation Limited, where he continues to innovate in the field of semiconductor technology. His work has had a significant impact on the efficiency and reliability of semiconductor packaging.

Collaborations

Wong collaborates with Kok Ping Tan, a coworker who shares his commitment to advancing technology in their field.

Conclusion

Siew Kong Wong's innovative approach to reducing warpage in semiconductor packages demonstrates his expertise and dedication to improving manufacturing processes. His contributions are vital to the ongoing development of reliable semiconductor technologies.