Stuttgart, Germany

Siegfried Kuklinski


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1985-1995

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2 patents (USPTO):Explore Patents

Title: Siegfried Kuklinski: Innovator in Cutting Technology

Introduction

Siegfried Kuklinski is a notable inventor based in Stuttgart, Germany. He has made significant contributions to the field of cutting technology, holding a total of 2 patents. His work focuses on improving the efficiency and effectiveness of cutting devices, particularly in granulating applications.

Latest Patents

Kuklinski's latest patents include an "Apparatus for aligning the cutting surfaces of cutting blades of a granulating device." This invention involves a process where an abrasive plate is detachably connected to the granulating hood, allowing for precise alignment of the cutting surfaces. The grinding operation can be performed in situ or separately, enhancing the versatility of the device. Another significant patent is for a "wear-protected workpiece of metal," specifically designed for plastic extruders. This workpiece features wear-resistant inserts that are locked in recesses, minimizing manufacturing and repair costs while allowing for the use of non-metallic materials.

Career Highlights

Kuklinski is associated with Werner & Pfleiderer GmbH, a company known for its innovative solutions in the field of food processing and plastics technology. His work has contributed to advancements in granulating devices, making them more efficient and user-friendly.

Collaborations

Throughout his career, Kuklinski has collaborated with notable colleagues such as Gerhard Gnadig and Willi Flottmann. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in cutting and granulating processes.

Conclusion

Siegfried Kuklinski's contributions to cutting technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of granulating devices and cutting technology.

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