Dalian, China

Shutao Qi

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations of Shutao Qi in Flexible Dot Matrix Bonding Technology

Introduction

Shutao Qi is a notable inventor based in Dalian, China. He has made significant contributions to the field of bonding technology, particularly with his innovative approach to flexible dot matrix bonding apparatuses. His work is characterized by a focus on enhancing the efficiency and effectiveness of bonding methods for disk-type planar components.

Latest Patents

Shutao Qi holds a patent for a "Flexible dot matrix bonding apparatus and adaptive clamping method for disk-type planar component." This invention discloses a flexible bonding apparatus that comprises three main components: a substrate, connecting rods, and an auxiliary support. The substrate features threaded holes arranged in a circumferential array, allowing the connecting rods to be fixed at various positions. This design plays a crucial role in bonding and supporting disk-type planar components. The auxiliary support ensures that the workpiece can be safely removed after processing, preventing damage. The invention also includes an adaptive clamping method that adjusts the installation positions of the connecting rods based on the detection results of machining deformation, ultimately reducing the deformation during machining.

Career Highlights

Shutao Qi is affiliated with Dalian University of Technology, where he continues to advance his research and development in bonding technologies. His innovative work has garnered attention in academic and industrial circles, contributing to the evolution of manufacturing processes.

Collaborations

Shutao Qi has collaborated with notable colleagues, including Yuwen Sun and Shuyang Yan. Their combined expertise has further enhanced the research and development efforts in their field.

Conclusion

Shutao Qi's contributions to flexible dot matrix bonding technology exemplify the innovative spirit of modern inventors. His patent reflects a significant advancement in the bonding process for disk-type planar components, showcasing the potential for improved manufacturing techniques.

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