Shu-Ming Chang

Title: Innovations by Shu-Ming Chang

Introduction

Shu-Ming Chang is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of printed circuit board technology. With a total of two patents to his name, his work focuses on enhancing the reliability of solder joints in electronic devices.

Latest Patents

Shu-Ming Chang's latest patents include innovative methods for printed circuit board mesh routing to reduce solder ball joint failure during the reflow process. His approach introduces voids in copper shapes to mitigate warpage experienced by printed circuit boards. These copper shapes are utilized to connect large packages, including ball grid arrays, to the printed circuit board. By routing a mesh pattern of voids in the copper shapes, his invention aims to reduce solder ball joint cracking and pad cratering during reflow, ultimately making solder joints more reliable. The voids, which may be 8 mil×8 mil cuts or indentations in the copper shape, help to alter the copper heat dissipation profile, thereby removing sharp warpage forces that can lead to pad cratering.

Career Highlights

Shu-Ming Chang is currently employed at Microsoft Technology Licensing, LLC, where he continues to innovate in the field of technology. His work has garnered attention for its practical applications in improving electronic device performance.

Collaborations

Some of his notable coworkers include Benito Joseph Rodriguez and Dillip Kumar Dash, who contribute to the collaborative environment at Microsoft Technology Licensing, LLC.

Conclusion

Shu-Ming Chang's contributions to printed circuit board technology exemplify the importance of innovation in enhancing electronic device reliability. His patents reflect a commitment to solving complex engineering challenges, making a significant impact in the industry.