Tokyo, Japan

Shozo Omori


Average Co-Inventor Count = 1.1

ph-index = 7

Forward Citations = 86(Granted Patents)


Location History:

  • Bunkyo, JP (1990)
  • Tokyo, JP (1979 - 1994)

Company Filing History:


Years Active: 1979-1994

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7 patents (USPTO):

Title: The Innovations of Shozo Omori

Introduction

Shozo Omori is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of packaging technology, particularly through his innovative shrink-wrapping methods. With a total of 7 patents to his name, Omori's work has had a lasting impact on the industry.

Latest Patents

One of Omori's latest patents is a thermal shrink-wrapping method and apparatus. This invention involves continuously pulling out a thermal shrink film and shaping it into a tubular form. Individual items to be wrapped are fed into the tubular film sequentially, and the overlapping marginal portions of the film are sealed lengthwise. The tubular film is then sealed and cut transversely at the front end of each item. By applying pressure, the internal volume of the tubular film is decreased, allowing for a more efficient packaging process. The film is subsequently sealed and cut at the rear end of each item to form an intermediate package. Finally, the film of the intermediate package is shrunk by heating, effectively shrink-wrapping the item.

Career Highlights

Throughout his career, Shozo Omori has worked with several prominent companies, including Omori Machinery Co., Ltd and Tokyo Shibaura Denki Kabushiki Kaisha. His experience in these organizations has contributed to his expertise in packaging technology and innovation.

Collaborations

Omori has collaborated with various professionals in his field, including his coworker Takeshi Sekiguchi. These partnerships have further enhanced his ability to develop cutting-edge solutions in packaging.

Conclusion

Shozo Omori's contributions to the field of packaging technology through his innovative shrink-wrapping methods have established him as a significant figure in the industry. His patents reflect a commitment to improving efficiency and effectiveness in packaging processes.

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