Iruma, Japan

Shouji Minegishi


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2013

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Shouji Minegishi: Innovator in Photocurable Resin Technology

Introduction

Shouji Minegishi is a notable inventor based in Iruma, Japan. He has made significant contributions to the field of photocurable and thermosetting resin compositions. His innovative work has led to advancements in the manufacturing of printed circuit boards.

Latest Patents

Minegishi holds a patent for a photocurable and thermosetting resin composition, which is essential for creating high-quality printed circuit boards. The composition includes a carboxyl group-containing resin, a photopolymerization initiator with an oxime linkage, a reactive diluent, and an epoxy compound with multiple epoxy groups. This unique formulation allows for the development of a system comprising at least two parts, enhancing the efficiency and effectiveness of the resin.

Career Highlights

Shouji Minegishi is associated with Taiyo Ink Manufacturing Co., Ltd., where he has been instrumental in advancing resin technology. His expertise in photocurable materials has positioned him as a key figure in the industry. Minegishi's work has not only contributed to his company but has also influenced the broader field of electronics manufacturing.

Collaborations

Minegishi has collaborated with notable colleagues, including Hideaki Kojima and Hidekazu Miyabe. These partnerships have fostered innovation and have been crucial in the development of new technologies in resin applications.

Conclusion

Shouji Minegishi's contributions to photocurable resin technology have made a lasting impact on the industry. His innovative patent and collaborations highlight his role as a leading inventor in this specialized field.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…