Company Filing History:
1 out of 822 
1 out of 630 Years Active: 1998
Title: Innovations by Shouei Ebisawa: Pioneering Bonding Processes
Introduction
Shouei Ebisawa, an inventor based in Kounosu, Japan, has made significant contributions to the field of materials bonding. With a focus on efficiency and precision, Ebisawa holds a patent that addresses critical challenges in the production of UV radiation-transmitting substrates. His work exemplifies the innovative spirit that drives advancements in technology.
Latest Patents
Ebisawa holds one notable patent titled "Process and device for bonding discs to one another." This invention facilitates the cementing of UV radiation-transmitting substrates efficiently and without deformation. The patented device incorporates a radiant light source designed to irradiate discs with ultraviolet radiation. It features a wavelength selector that transmits ultraviolet rays while absorbing certain wavelengths to protect the materials during the bonding process. Additionally, a cooling device ensures optimal performance by regulating air circulation, thereby enhancing the efficiency of the bonding operation.
Career Highlights
Shouei Ebisawa has worked with prominent companies such as Ushio Denki Kabushiki Kaisha and Dainippon Ink and Chemicals, Incorporated. His experience in these organizations has shaped his understanding of material applications and led to the development of his pioneering patent in the field of disc bonding technologies.
Collaborations
Throughout his career, Ebisawa collaborated with other talented individuals in the industry, such as Tetsuji Arai and Toshio Yokota. These collaborations have likely contributed to his innovative approach and successful outcomes in his inventions.
Conclusion
Shouei Ebisawa's contributions to the field of bonding processes for UV radiation-transmitting substrates highlight his innovative capabilities. Through his patented technologies and collaborations with notable companies and professionals, Ebisawa continues to play an essential role in advancing material bonding solutions, demonstrating the impact of individual inventors on modern technology.