Shinya Ochi

Title: Shinya Ochi: Innovator in Metal-Laminated Polyimide Substrates

Introduction

Shinya Ochi is a prominent inventor based in Ehime, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced substrates. His innovative work focuses on enhancing the properties of polyimide substrates through effective production methods.

Latest Patents

One of Shinya Ochi's notable patents is for a "Metal-laminated polyimide substrate, and method for production thereof." This invention aims to provide a laminated polyimide substrate that ensures various properties are maintained over time under stringent conditions. The patent emphasizes the importance of sufficient adhesion between the polyimide film and the metal layer. The laminated structure consists of a polyimide layer, an alkali-treated layer derived from the polyimide layer, and a metal layer, arranged in that order. The alkali-treated layer contains an anionic functional group and features a complex of a metal catalyst on both sides of the substrate.

Career Highlights

Shinya Ochi is associated with Ebara-udylite Co., Ltd., where he continues to push the boundaries of material innovation. His work has garnered attention for its practical applications in various industries, particularly in electronics and aerospace.

Collaborations

Shinya Ochi collaborates with esteemed colleagues such as Ryuichi Nakagami and Makoto Kohtoku. Their combined expertise contributes to the advancement of technology in their field.

Conclusion

Shinya Ochi's contributions to the development of metal-laminated polyimide substrates highlight his innovative spirit and dedication to material science. His work not only enhances the properties of substrates but also paves the way for future advancements in technology.