Shinya Nitta

Title: Shinya Nitta: Innovator in Blister Packaging Technology

Introduction

Shinya Nitta is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of packaging technology, particularly in the development of blister packages. With a total of 4 patents to his name, Nitta's work has advanced the functionality and efficiency of packaging solutions.

Latest Patents

Nitta's latest patents include innovative designs and methods for blister packages. One of his notable inventions is a blister package that features a sheet with formed pockets and a lid material that seals the sheet. This design includes a first pocket that accommodates an RF tag and a second pocket that holds an article, ensuring that the two are separated. Additionally, he has developed an RFID tag for flexible material products, which includes an RFID antenna that is resistant to disconnection and closely integrated with the flexible material. His work also encompasses an RFID antenna continuous body for the RFID tag, enhancing the reliability of wireless data communication.

Career Highlights

Throughout his career, Shinya Nitta has worked with several notable companies, including Sato Holdings and Hino Motors, Ltd. His experience in these organizations has contributed to his expertise in packaging technology and innovation.

Collaborations

Nitta has collaborated with talented individuals in his field, including Yoshiki Ihara and Hisaki Toorisaka. These partnerships have fostered a creative environment that has led to the development of groundbreaking packaging solutions.

Conclusion

Shinya Nitta's contributions to blister packaging technology and RFID innovations highlight his role as a key inventor in the industry. His patents reflect a commitment to enhancing packaging functionality and efficiency.