Saitama, Japan

Shinya Hiraoka

USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: Shinya Hiraoka: Innovator in Surface-Treated Copper Foil Technology

Introduction

Shinya Hiraoka is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper foil technologies. His innovative work has led to the creation of a patent that addresses critical performance issues in copper foils used in various applications.

Latest Patents

Hiraoka holds a patent for a surface-treated copper foil. The primary objective of this invention is to provide a copper foil that exhibits excellent softening resistance performance. This innovation reduces the decrease in tensile strength after heat treatment at temperatures ranging from approximately 350°C to 400°C. The surface-treated copper foil features a rust-proofing treatment layer on both surfaces, which is constituted by a zinc alloy. The zinc alloy layer contains a zinc amount ranging from 20 mg/m² to 1,000 mg/m². Additionally, the copper foil incorporates small amounts of elements such as carbon, sulfur, chlorine, and nitrogen, with a total amount of 100 ppm or more.

Career Highlights

Shinya Hiraoka is associated with Mitsui Mining & Smelting Company, Ltd., where he has been instrumental in advancing the company's research and development efforts. His work has not only contributed to the company's portfolio but has also enhanced the performance and reliability of copper foils in various industrial applications.

Collaborations

Hiraoka has collaborated with notable colleagues, including Shinichi Obata and Fumiaki Hosokoshi. These collaborations have fostered a productive environment for innovation and have led to the successful development of new technologies in the field.

Conclusion

Shinya Hiraoka's contributions to the field of materials science, particularly through his patented surface-treated copper foil, demonstrate his commitment to innovation and excellence. His work continues to impact the industry positively, paving the way for advancements in copper foil technology.

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