Company Filing History:
2 out of 27,375 
1 out of 16,453 
Years Active: 2005-2010
Title: Shinya Esaki: Innovator in Integrated Circuit Technology
Introduction
Shinya Esaki is a prominent inventor based in Osaka, Japan. He is known for his contributions to the field of integrated circuit technology. With a total of 3 patents to his name, Esaki has made significant advancements in the packaging structures of integrated circuits.
Latest Patents
One of his latest patents focuses on an integrated circuit device packaging structure and packaging method. This innovative packaging structure is designed for integrated circuit devices that receive short-wavelength laser light. The design includes a lead-mounted substrate positioned on the side of the light receiving surface of the integrated circuit device, which contains a photo detecting part. The lead is electrically connected to the integrated circuit device via an electrode. Both the integrated circuit device and the substrate are encapsulated within an encapsulation section, and the substrate features an opening above the photo detecting part.
Career Highlights
Throughout his career, Shinya Esaki has worked with notable companies such as Matsushita Electric Industrial Co., Ltd. and Panasonic Corporation. His experience in these organizations has contributed to his expertise in integrated circuit technology and innovation.
Collaborations
Esaki has collaborated with esteemed colleagues, including Yasufumi Shirakawa and Masaki Taniguchi. These collaborations have further enriched his work and contributions to the field.
Conclusion
Shinya Esaki's innovative work in integrated circuit technology has led to significant advancements in the industry. His patents reflect his commitment to improving the functionality and efficiency of integrated circuit devices. His contributions continue to influence the field and inspire future innovations.