Location History:
- Tokyo, JP (1996)
- Kanagawa, JP (2011)
Company Filing History:
3 out of 35,734 
2 out of 7,529 
Years Active: 1996-2011
Title: Innovations and Contributions of Inventor Shin-ichi Ogou
Introduction
Shin-ichi Ogou is a notable inventor based in Kanagawa, Japan, recognized for his innovative contributions to the field of electrical engineering. With a total of three patents to his name, Ogou has made significant strides, particularly in developing broadband transitions for multilayer substrates. His work is critical for enhancing signal integrity in electronic designs.
Latest Patents
Ogou's latest patents focus on a sophisticated broadband transition from a via interconnection to a planar transmission line in a multilayer substrate. This invention is a critical development as it forms an intermediate connection between the signal via pad and the planar transmission line located within the same conductor layer. The unique design features transverse dimensions equal to the via pad diameter on one side and the strip width on the other. The length of the transition is optimized to match the characteristics of the clearance hole in the direction of the planar transmission line, effectively minimizing excess inductive reactance in time domains, as substantiated by extensive three-dimensional full-wave simulations.
Career Highlights
Shin-ichi Ogou has worked with renowned organizations, making his mark at NEC Corporation and Renesas Electronics Corporation. His tenure at these companies has allowed him to collaborate on various projects, further advancing his understanding and expertise in electronic design and patent innovations.
Collaborations
During his career, Ogou has collaborated with notable peers like Taras Kushta and Kaoru Narita. These partnerships have enriched his work, fostering an environment where innovative ideas can flourish and lead to successful patent applications.
Conclusion
In conclusion, Shin-ichi Ogou stands out as a prominent inventor whose work continues to impact the field of electrical engineering. With three patents to his credit and significant collaborations throughout his career, his innovations pave the way for future advancements in multilayer substrates and broadband transitions. His contributions not only enhance technological designs but also inspire emerging inventors in the industry.