Shih-Neng Dai

Title: Innovations of Shih-Neng Dai in Multichip Package Structures

Introduction

Shih-Neng Dai is a notable inventor based in Zhongli, Taiwan. He has made significant contributions to the field of semiconductor lighting technology, holding three patents that showcase his innovative designs and solutions.

Latest Patents

One of his latest patents is a multichip package structure for directly electrically connecting to an AC power source. This design includes a substrate unit, a light-emitting unit, a control module, a frame unit, and a package unit. The substrate unit features a first chip-placing region and a second chip-placing region. The light-emitting unit consists of multiple light-emitting chips connected to the first chip-placing region. The control module incorporates at least one current-limiting unit and a rectifier unit, which are electrically connected to the second chip-placing region and the light-emitting unit. The frame unit is designed with a first annular colloid frame surrounding the light-emitting chips and a second annular colloid frame surrounding the current-limiting unit and the rectifier unit. The package unit includes a first package colloid body that covers the light-emitting chips and a second package colloid body that covers the current-limiting unit and the rectifier unit.

Another significant patent by Dai is the light-mixing multichip package structure. This structure comprises a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit features at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame, which surround the respective light-emitting modules. The package unit consists of a transparent colloid body and a phosphor colloid body that cover the first and second light-emitting modules, respectively. This innovative design allows for the mixing of red and blue light sources, enhancing the color rendering index (CRI) of the light-mixing multichip package structure.

Career Highlights

Shih-Neng Dai is currently employed at Paragon Semiconductor Lighting Technology Co., Ltd. His work focuses on advancing lighting technologies through innovative semiconductor solutions. His patents reflect his commitment to improving the efficiency and effectiveness of lighting systems.

Collaborations