Shih-Chi Chen

Title: Innovations of Shih-Chi Chen in Multi-Chip Packaging Technology.

Introduction

Shih-Chi Chen is a notable inventor based in Zhubei, Taiwan. He has made significant contributions to the field of packaging technology, particularly in multi-chip systems. His innovative approach has led to advancements that enhance the efficiency and functionality of electronic devices.

Latest Patents

Shih-Chi Chen holds a patent for a "Multi-chips in system level and wafer level package structure." This invention includes a package substrate with multiple through holes, accommodating multi-chips of varying functions and sizes. The design incorporates metal wires, a package body, and conductive components. The multi-chips are strategically combined with the package substrate, allowing their pads to be exposed through the holes. These pads are electrically connected to adjacent connecting terminals via conductive wires. The package material fills the through holes, encapsulating the conductive wires and active surfaces of the multi-chips, thereby achieving a sophisticated multi-chip packaging structure through a partial packaging method.

Career Highlights

Shih-Chi Chen is currently associated with Gainia Intellectual Asset Services, Inc., where he continues to innovate in the field of intellectual property and technology. His work focuses on enhancing the capabilities of electronic packaging, which is crucial for modern electronic devices.

Collaborations

Shih-Chi Chen collaborates with Hao-Pai Lee, who is also a key contributor in their field. Their partnership exemplifies the importance of teamwork in driving innovation and achieving technological advancements.

Conclusion

Shih-Chi Chen's contributions to multi-chip packaging technology reflect his dedication to innovation and excellence. His patent showcases a significant advancement in the field, paving the way for more efficient electronic systems.