Company Filing History:
Years Active: 1984
Title: Shigetoshi Seta: Innovator in Hot-Melt Adhesives
Introduction
Shigetoshi Seta is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of adhesives, particularly with his innovative hot-melt adhesive technology. His work emphasizes the importance of environmental considerations and efficiency in adhesive applications.
Latest Patents
Shigetoshi Seta holds a patent for a hot-melt adhesive and method. This adhesive comprises a self-curing unsaturated polyester resin that features an air-drying functional group and an average polymerization degree of 8 or more. The adhesive demonstrates excellent heat resistance and high bonding strength when cured under heat and pressure. The incorporation of additives such as polymerization initiators, promoters, and photosensitizers significantly enhances the curing speed beyond what is achievable with conventional adhesives. Additionally, the adhesive can be structured in various composite forms, improving its pot life and bonding strength. Notably, this hot-melt adhesive is solvent-free and avoids the use of vinyl monomers, making it environmentally friendly and easy to handle.
Career Highlights
Throughout his career, Shigetoshi Seta has focused on developing advanced adhesive technologies. His innovative approach has led to the creation of products that not only meet performance standards but also address environmental concerns. His patent reflects a commitment to improving adhesive formulations for various applications.
Collaborations
Shigetoshi Seta has collaborated with notable colleagues, including Soichi Muroi and Yoshio Matsumoto. These partnerships have contributed to the advancement of adhesive technologies and the successful development of innovative products.
Conclusion
Shigetoshi Seta's contributions to the field of hot-melt adhesives highlight his innovative spirit and dedication to creating environmentally friendly solutions. His work continues to influence the adhesive industry and showcases the potential for advancements in material science.