Location History:
- Tokyo, JP (1986 - 1987)
- Nirasaki, JP (2002 - 2008)
Company Filing History:
Years Active: 1986-2008
Title: Shigekazu Matsui: Innovator in Multilayer Printed Wiring Board Technology
Introduction
Shigekazu Matsui is a prominent inventor based in Nirasaki, Japan. He has made significant contributions to the field of electronics, particularly in the development of multilayer printed wiring boards. With a total of 6 patents to his name, Matsui's work has been instrumental in advancing technology in this area.
Latest Patents
One of Matsui's latest patents is focused on a multilayer printed wiring board and the process of producing it. This innovative design allows for the formation of fine wiring patterns, which increases the density of wiring patterns. The process involves using photosensitive glass with a thermal expansion coefficient similar to that of copper film as a core substrate. Through photolithography, a through hole is created in the photosensitive glass. Subsequently, layers of sputtered silicon oxide and silicon nitride are applied to prevent the leakage of alkali metal ions. Additional sputtered layers of chromium, chromium-copper, and copper enhance the adhesion strength between the copper film and the silicon oxide layer. Finally, a copper film of 1 to 20 μm thick is formed, and the interior of the through hole is filled with resin. The wiring layer is then patterned through etching, followed by the formation of an insulating layer and a surface treatment layer.
Career Highlights
Matsui is currently associated with Hoya Corporation, a leading company in the optical and electronic industries. His work at Hoya has allowed him to push the boundaries of technology in printed wiring boards, contributing to the company's reputation for innovation.
Collaborations
Matsui has collaborated with notable colleagues such as Masao Ushida and Takashi Fushie. These partnerships have fostered a creative environment that has led to significant advancements in their respective fields.
Conclusion
Shigekazu Matsui's contributions to multilayer printed wiring board technology exemplify his innovative spirit and dedication to advancing electronic design. His patents reflect a commitment to enhancing the efficiency and effectiveness of electronic components.