Company Filing History:
1 out of 832,843 Years Active: 2009
Title: Shien Chen Liu: Innovator in Integrated Circuit Packing Technology
Introduction: Shien Chen Liu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of integrated circuit technology, particularly with his innovative patent that addresses the challenges of high-hardness and corrosion-tolerant packing molds.
Latest Patents: Liu holds a patent for a "High-hardness and corrosion-tolerant integrated circuit packing mold." This invention comprises a package mold that includes at least one filling channel, at least one mold cavity, and at least one channel between the mold cavities. The design features a protecting layer deposited upon the surfaces of the package mold, which is an amorphous coating layer. In one embodiment, the protecting layer is a graded layer that includes an amorphous coating layer and a middle layer. In another embodiment, it is a multiplayer structure formed by at least one amorphous coating layer and at least one polycrystal coating layer. Additionally, the protecting layer can be a compound structure formed by distributing polycrystal material into an amorphous coating layer. Liu's innovative approach enhances the durability and performance of integrated circuits.
Career Highlights: Throughout his career, Shien Chen Liu has focused on advancing technology in the semiconductor industry. His work has led to the development of solutions that improve the reliability and efficiency of integrated circuits. Liu's dedication to innovation is evident in his patent, which showcases his expertise in material science and engineering.
Collaborations: Liu has collaborated with talented individuals in his field, including Yin Chang and Da Yung Wang. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion: Shien Chen Liu's contributions to integrated circuit packing technology exemplify the spirit of innovation. His patent for a high-hardness and corrosion-tolerant packing mold represents a significant advancement in the semiconductor industry. Liu's work continues to influence the field, paving the way for future innovations.