Company Filing History:
Years Active: 2000
Title: **Innovations of Shiang Ching Cheng: A Pioneer in Chip Technology**
Introduction
Shiang Ching Cheng, an accomplished inventor based in Hsin Chu, Taiwan, has made significant contributions to the field of semiconductor technology. With a notable patent to his name, Cheng is recognized for his innovative methods in creating via holes in chips, enhancing manufacturing efficiency and lowering costs in chip production.
Latest Patents
Cheng's most prominent patent, titled "Method for Creating Via Hole in Chip," provides a groundbreaking approach to chip design. This method involves utilizing a pre-patterned transparent mask on the back of a chip or multiple chips from a wafer. By bombarding the chips through positioning holes in the mask that correspond to a pre-formed pattern with accelerated particles, he enables the creation of via holes without disrupting the existing integrated circuit structure. This approach not only allows for simultaneous formation of multiple via holes, but it also eliminates the need for precision apparatus, making it a cost-effective solution for manufacturers.
Career Highlights
Cheng has been instrumental in pushing the boundaries of innovation at Microjet Technology Company, Ltd., where he contributes his expertise to various projects. His efforts have streamlined processes within the company, reflecting a strong focus on advancing chip technology and maintaining high standards of efficiency and effectiveness.
Collaborations
Throughout his career, Cheng has collaborated with notable colleagues such as Tse-Chi Mou and Chin-Yi Chou. Such collaborations underscore the importance of teamwork in driving technological advancements, as they bring together diverse skill sets and perspectives in the pursuit of innovation.
Conclusion
Shiang Ching Cheng's dedication to enhancing semiconductor technologies through his innovative methods showcases the impact an inventor can make in the industry. His patent not only represents a significant step forward in chip manufacturing but also highlights the collaborative spirit within the tech community, paving the way for future innovations in the field.