Company Filing History:
Years Active: 2000
Title: Innovations by Shi-Lang Yang
Introduction
Shi-Lang Yang is an accomplished inventor based in Brooklyn, NY. He has made significant contributions to the field of modular circuit design. His innovative approach has led to the development of a unique assembly method that enhances performance while reducing costs.
Latest Patents
Shi-Lang Yang holds a patent for a "Miniature low cost modular assembly package and method of assembly." This invention features a modular miniature circuit built entirely within the case of the module, eliminating the need for a primary printed circuit board. The circuit components are mounted inside the case, with leads attached directly to the module's terminals. This design greatly reduces lead inductance and results in a substantial decrease in both cost and physical size. Additionally, the reduction in lead lengths significantly enhances high-frequency performance. The 'flip chip' construction provides a flat surface for automatic assembly equipment, eliminating the added cost of a cover.
Career Highlights
Shi-Lang Yang is currently employed at Scientific Component, Inc. His work has been pivotal in advancing modular circuit technology. He has demonstrated a commitment to innovation and efficiency in his designs.
Collaborations
Some of his notable coworkers include Dhiren Bhatt and Wei-Ping Zheng. Their collaborative efforts contribute to the success of projects at Scientific Component, Inc.
Conclusion
Shi-Lang Yang's innovative contributions to modular circuit design exemplify the impact of creativity in technology. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving electronic assembly methods.