Hefei, China

Shengyang Wei

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Anhui University. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shengyang Wei. Retrieved from https://idiyas.com/inventor/shengyang-wei-znuf9cja

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 11.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations of Shengyang Wei in Electromagnetic Band Gap Structures

Introduction

Shengyang Wei is a prominent inventor based in Hefei, China. He is known for his contributions to the field of electromagnetic band gap (EBG) structures. His innovative work has led to the development of advanced technologies that enhance circuit board performance.

Latest Patents

Shengyang Wei holds a patent for an "Ultra-wideband electromagnetic band gap (EBG) structure and circuit board." This invention includes multiple EBG units arranged in an array. Each unit consists of a power plane, a dielectric substrate, and a ground plane. The power plane features a patch, a coupled complementary split ring resonator (C-CSRR), and several semi-improved Z-bridge structures. The design allows for improved connectivity and performance in electronic applications.

Career Highlights

Shengyang Wei is affiliated with Anhui University, where he continues to engage in research and development. His work focuses on enhancing the capabilities of electronic devices through innovative EBG structures. With a patent portfolio that includes 1 patent, he has made significant strides in his field.

Collaborations

Shengyang Wei collaborates with notable colleagues, including Xingang Ren and Yali Zhao. Their combined expertise contributes to the advancement of research in electromagnetic technologies.

Conclusion

Shengyang Wei's contributions to the field of electromagnetic band gap structures demonstrate his innovative spirit and commitment to advancing technology. His work at Anhui University and his patent on EBG structures highlight his role as a key inventor in this domain.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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