Shawn M Mahon

Title: Innovations of Shawn M Mahon

Introduction

Shawn M Mahon is an accomplished inventor based in Howard Lake, MN (US). He has made significant contributions to the field of circuit module construction, particularly with his innovative designs that enhance packaging density and surface area for I/O pads.

Latest Patents

Shawn holds a patent for a high density stacked circuit module. This invention utilizes a flex circuit attached to a substrate, which is then folded over to achieve higher packaging density. The design allows for an increase in the surface area available for I/O pads, making it a notable advancement in circuit module technology. The substrate features components such as integrated circuits (ICs) mounted on one surface, while module I/O pads are located on the opposite surface. This configuration not only provides interconnects for the flex circuit but also maximizes the available area for mounting additional circuit components.

Career Highlights

Shawn is currently employed at Hei, Inc., where he continues to innovate and develop advanced circuit technologies. His work has been instrumental in pushing the boundaries of what is possible in circuit design and construction.

Collaborations

Shawn collaborates with talented individuals such as Theodore T Paczkowski and Steven R Schmieg, who contribute to the innovative environment at Hei, Inc. Their combined expertise fosters a culture of creativity and advancement in circuit technology.

Conclusion

Shawn M Mahon is a notable inventor whose work in high density circuit module construction exemplifies innovation in the field. His contributions continue to influence the design and functionality of circuit modules, paving the way for future advancements.