Company Filing History:
Years Active: 2010-2013
Title: Shashikant Hegde: Innovator in Semiconductor Technology
Introduction
Shashikant Hegde is a notable inventor based in Boise, Idaho, recognized for his contributions to semiconductor technology. He holds a total of four patents, showcasing his innovative approach to electrical interconnects and lens manufacturing.
Latest Patents
Hegde's latest patents include "Liquid electrical interconnect and devices using same," which describes various embodiments of interconnects for semiconductor structures. These structures consist of a first conductive structure, a second conductive structure, and a non-hardening liquid conductive material that contacts both structures. Other embodiments focus on semiconductor components and imager devices utilizing these interconnects. Additionally, he has developed a patent for "Thermal embossing of resist reflowed lenses to make aspheric lens master wafer." This patent outlines methods for creating a lens master wafer with aspheric lens shapes, involving the coating of a substrate with polymer material and the formation of isolated sections that are reflowed into aspheric shapes using a lens stamp.
Career Highlights
Shashikant Hegde has made significant strides in his career, particularly through his work at Aptina Imaging Corporation. His innovative patents have contributed to advancements in semiconductor technology and imaging devices, establishing him as a key figure in the field.
Collaborations
Hegde has collaborated with notable colleagues, including Rick C Lake and Jacques Duparre, further enhancing his contributions to the industry.
Conclusion
Shashikant Hegde's work in semiconductor technology and his innovative patents reflect his expertise and commitment to advancing the field. His contributions continue to influence the development of new technologies in imaging and electrical interconnects.