Hopewell Junction, NY, United States of America

Shaji Faroon


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 24(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Shaji Faroon

Introduction

Shaji Faroon is an accomplished inventor based in Hopewell Junction, NY, renowned for his contributions to the field of electronic packaging. With a focus on enhancing the reliability of flip chip technology, he has developed solutions that address common challenges in the industry.

Latest Patents

Faroon holds a significant patent for a dielectric interposer designed specifically for chip to substrate soldering. This innovative device works to prevent short circuits between solder joints in flip chip packaging. The dielectric interposer features a multitude of apertures or vias that align with the input/output pads on both the chip and substrate. Made from materials such as polyester film, glass, alumina, and polyimide, the interposer contains adhesive layers to ensure a secure bond. Its design includes cone-shaped solder elements that form within the apertures, enhancing electrical and mechanical interconnections once thermally reflowed. This invention not only isolates solder joints but also prevents over-compression, ensuring optimum performance in electronic modules.

Career Highlights

Shaji Faroon is affiliated with the International Business Machines Corporation (IBM), where he continues to innovate in the field of electronics. His work significantly contributes to improving the reliability and efficiency of electronic packaging solutions.

Collaborations

Throughout his career, Faroon has collaborated with notable colleagues including Peter Jeffrey Brofman and John Ulrich Knickerbocker. These collaborations foster an environment of innovation, bringing together diverse expertise to advance technology.

Conclusion

Shaji Faroon's innovative approach to electronic packaging, exemplified by his dielectric interposer patent, underscores the critical role inventors play in technological advancement. His work at IBM and collaborations with esteemed coworkers have solidified his status as a significant contributor to the field, paving the way for future innovations in chip packaging technology.

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