Company Filing History:
Years Active: 2024
Title: Seungjun Noh: Innovator in Bonding Technology
Introduction
Seungjun Noh is a prominent inventor based in Suita, Japan. He has made significant contributions to the field of bonding technology, particularly through his innovative patent work. His expertise and dedication to research have positioned him as a valuable asset in the academic and technological communities.
Latest Patents
Seungjun Noh holds a patent for a bonding member, which includes surface-processed silver surfaces. The patent is titled "Bonding member, method for producing bonding member and method for producing bonding structure." This invention showcases his ability to develop advanced materials that enhance bonding processes in various applications. He has 1 patent to his name.
Career Highlights
Noh is affiliated with Osaka University, where he engages in cutting-edge research and development. His work at the university allows him to collaborate with other experts in the field and contribute to the advancement of bonding technologies. His academic background and research initiatives have garnered attention in the scientific community.
Collaborations
Seungjun Noh has worked alongside notable colleagues, including Katsuaki Suganuma and Chuantong Chen. These collaborations have fostered a dynamic research environment, leading to innovative solutions and advancements in bonding technology.
Conclusion
Seungjun Noh is a distinguished inventor whose work in bonding technology has made a significant impact. His patent and collaborations reflect his commitment to innovation and excellence in research. His contributions continue to influence the field and inspire future advancements.