Location History:
- Ithaca, NY (US) (2001)
- Johnson City, NY (US) (2002)
- Fishkill, NY (US) (2001 - 2008)
Company Filing History:
Years Active: 2001-2008
Title: Seungbae Park: Innovator in Chip Packaging Technology
Introduction
Seungbae Park is a notable inventor based in Fishkill, NY (US). He has made significant contributions to the field of chip packaging technology, holding a total of 5 patents. His work focuses on innovative solutions that enhance the performance and reliability of electronic devices.
Latest Patents
One of Seungbae Park's latest patents is the "Wafer Scale Thin Film Package." This invention involves a chip module that features a chip with a flexible multilayer redistribution thin film attached for connection to a substrate. The thin film serves dual purposes: it acts as a redistribution medium with multiple layers of metallurgy for chip power and signals, and it also functions as a compliant medium to alleviate stresses caused by thermal expansion mismatches between the chip and substrate. The modules can be fabricated at either the chip or wafer level, with the upper surface of the thin film having an array of pads that match those on the chip or wafer, while the lower surface has pads that correspond to the substrate. The multilayer thin film is initially formed on a temporary substrate, after which the chip is attached before being released from the temporary substrate. Once released, the module is ready for mounting onto a second-level packaging substrate, such as a chip carrier or PCB. If the multilayer thin film is formed directly on a wafer, the wafer is subsequently diced to create the module.
Career Highlights
Seungbae Park is currently employed at International Business Machines Corporation (IBM), where he continues to innovate in the field of chip packaging. His work has been instrumental in advancing technologies that are critical to modern electronics.
Collaborations
Throughout his career, Seungbae has collaborated with notable colleagues, including Sanjeev Balwant Sathe and David V Caletka. These collaborations have further enriched his contributions to the field.
Conclusion
Seungbae Park's innovative work in chip packaging technology exemplifies the impact of dedicated inventors in the electronics industry. His patents and collaborations continue to shape the future of electronic device performance and reliability.