Yongin-si, South Korea

Seung Tae Yang

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.8

ph-index = 1


Company Filing History:


Years Active: 2024-2025

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3 patents (USPTO):Explore Patents

Title: Seung Tae Yang: Innovator in Substrate Processing Technology

Introduction

Seung Tae Yang is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of substrate processing, holding a total of 3 patents. His innovative work focuses on improving the efficiency and effectiveness of substrate treatment methods.

Latest Patents

Seung Tae Yang's latest patents include a substrate processing apparatus and a substrate processing method that features a processing liquid supply unit. This apparatus includes a nozzle that supplies a processing liquid onto the substrate, a supply line connected to the nozzle, and a cooler that cools the processing liquid. The cooler reduces the volume of the processing liquid, allowing it to be effectively sucked. Another notable patent is for a method of treating a substrate in multiple chambers. This method involves performing liquid treatment on a substrate located in a chamber through a supply line that connects to a circulation line. The flow rate of the liquid is carefully controlled to maintain a reference flow rate, ensuring optimal treatment of the substrate.

Career Highlights

Seung Tae Yang is currently employed at Semes Co., Ltd., where he continues to develop innovative solutions in substrate processing technology. His work has been instrumental in advancing the capabilities of substrate treatment methods, making significant impacts in the industry.

Collaborations

Seung Tae Yang collaborates with talented coworkers, including Do Gyeong Ha and Moon Soon Choi. Their combined expertise contributes to the success of their projects and innovations.

Conclusion

Seung Tae Yang is a dedicated inventor whose work in substrate processing technology has led to valuable patents and advancements in the field. His contributions continue to shape the future of substrate treatment methods.

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