Company Filing History:
Years Active: 2002
Title: Seung Ryul Ryu: Innovator in Semiconductor Packaging
Introduction
Seung Ryul Ryu is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative methods for forming ground vias in semiconductor packages. His work has implications for the efficiency and reliability of electronic devices.
Latest Patents
Seung Ryul Ryu holds 1 patent for his invention titled "Methods for forming ground vias in semiconductor packages." This patent describes a tape ball grid array (TBGA) semiconductor package that features a one metal layer interconnect substrate. The method outlined in the patent includes several steps to create electrical connections through the substrate down to a ground plane, enhancing the functionality of semiconductor packages.
Career Highlights
Ryu is currently employed at Signetics, where he continues to develop innovative solutions in semiconductor technology. His expertise in this area has positioned him as a valuable asset to his company and the industry at large.
Collaborations
Throughout his career, Seung Ryul Ryu has collaborated with notable colleagues, including Ju Yung Sohn and Marcos Karnezos. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Seung Ryul Ryu's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to advancing technology in this field. His work not only enhances the performance of electronic devices but also showcases the importance of innovation in the ever-evolving tech landscape.