Seung Hun Shin

Title: The Innovative Contributions of Seung Hun Shin

Introduction

Seung Hun Shin is a notable inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology. His work has led to the development of innovative devices that enhance the efficiency and functionality of electronic components.

Latest Patents

Seung Hun Shin holds a patent for a semiconductor package. This invention comprises a first semiconductor chip that includes a first chip substrate and a first through via penetrating the substrate. Additionally, it features a second semiconductor chip disposed on the first chip, which includes a second chip substrate and a second through via. A connecting terminal is positioned between the two chips to electrically connect the first and second through vias. The device also incorporates an inter-chip molding material that fills the space between the chips and encloses the connecting terminal, along with an extension portion and a protruding portion.

Career Highlights

Seung Hun Shin is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to be at the forefront of semiconductor innovation. He has demonstrated a commitment to advancing technology through his inventive solutions.

Collaborations

Throughout his career, Seung Hun Shin has collaborated with talented individuals such as Un Byoung Kang and Yeong Kwon Ko. These collaborations have contributed to the successful development of his innovative projects.

Conclusion

Seung Hun Shin's contributions to semiconductor technology exemplify the spirit of innovation. His patent for a semiconductor package showcases his ability to create solutions that meet the demands of modern electronics. His work continues to influence the industry and inspire future advancements.