Company Filing History:
Years Active: 2016-2018
Title: Innovations of Seung-Dae Seok in Semiconductor Technology
Introduction
Seung-Dae Seok is a notable inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to bonding processes.
Latest Patents
Seung-Dae Seok's latest patents include a bonding stage and bonding apparatus. The bonding stage features a first heater located under a first region of a substrate, which supports multiple semiconductor chips. It also includes a second heater positioned under a different region of the substrate. A cooler is integrated to prevent heat transfer from the heaters to the lower portions, ensuring efficient operation. Additionally, a thin plate is placed on the heaters to support the substrate while transferring heat effectively. The independent operation of the first and second heaters allows for precise control during the bonding process.
His second patent, the apparatus for bonding semiconductor chips, consists of a bonding head designed to adsorptively pick up a semiconductor chip. This apparatus supports a substrate on which the semiconductor chip is to be bonded. It features two cameras for capturing images and obtaining positional information of both the semiconductor chip and the substrate. A correction device structure is included to enhance the accuracy of the bonding position, controlled by a bonding controller.
Career Highlights
Seung-Dae Seok is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work focuses on advancing semiconductor technologies, which are crucial for modern electronic devices.
Collaborations
He collaborates with talented coworkers, including Sang-Yoon Kim and Hui-Jae Kim, who contribute to the innovative projects at Samsung Electronics.
Conclusion
Seung-Dae Seok's contributions to semiconductor technology through his patents reflect his expertise and commitment to innovation. His work continues to influence the development of advanced electronic components.