Serena M Luo

Title: The Innovations of Serena M Luo

Introduction

Serena M Luo is a notable inventor based in Milpitas, CA (US). She has made significant contributions to the field of semiconductor technology. Her work focuses on improving the structures used in semiconductor dies, which are crucial for modern electronic devices.

Latest Patents

Serena holds a patent titled "Bump formation on yielded semiconductor dies." This invention provides a hermetically sealed bond pad at the surface of a semiconductor chip. The ball bump structure includes an adhesion pad formed at the surface of the bond pad, which consists of a barrier layer, preferably a titanium/tungsten alloy, and a bonding layer, such as a sputtered gold layer. A gold ball bump is then formed on the adhesion pad. The patent also discloses methods for forming this improved structure.

Career Highlights

Serena is currently employed at VLSI Technology, Inc., where she continues to innovate in semiconductor technology. Her work has led to advancements that enhance the reliability and performance of semiconductor devices.

Collaborations

Throughout her career, Serena has collaborated with talented individuals such as Tsing-Chow Wang and Marlita F Macaraeg. These collaborations have contributed to her success and the development of her innovative ideas.

Conclusion

Serena M Luo's contributions to semiconductor technology exemplify the impact of innovation in the electronics industry. Her patent and ongoing work at VLSI Technology, Inc. highlight her role as a leading inventor in this field.