Aalen, Germany

Sepp-Dieter Michaelis


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Sepp-Dieter Michaelis: Innovator in Connection Assembly Technology

Introduction

Sepp-Dieter Michaelis is a notable inventor based in Aalen, Germany. He has made significant contributions to the field of electronic equipment through his innovative designs and patents. His work focuses on improving the connection assembly of printed-circuit boards and connectors, which is crucial for the functionality of electronic devices.

Latest Patents

Michaelis holds a patent for a "Connection assembly of printed-circuit board and connector and an electronic-equipment plug-in card provided with same." This invention allows for a printed-circuit board and a connector to be fixed positionally accurately in relation to one another. The design incorporates position holders made of soldering pins, which connect to soldering pads on the printed-circuit board. This method enhances the precision and ease of assembly compared to previous techniques.

Career Highlights

Throughout his career, Sepp-Dieter Michaelis has been associated with Itt Manufacturing Enterprises, Inc. His work has been instrumental in advancing connection assembly technology, making it more efficient and reliable for various electronic applications. His innovative approach has garnered attention in the industry, showcasing his expertise and commitment to improving electronic connectivity.

Collaborations

Michaelis has collaborated with notable coworkers, including Michael Duane Baginy and Iain Thomas Learmonth. These partnerships have contributed to the development of advanced technologies in the field of electronics.

Conclusion

Sepp-Dieter Michaelis is a distinguished inventor whose work in connection assembly technology has made a lasting impact on the electronics industry. His innovative patent demonstrates his commitment to enhancing the precision and efficiency of electronic device assembly.

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