Seongyo Kim

Title: Seongyo Kim - Innovator in Semiconductor Packaging

Introduction

Seongyo Kim is a prominent inventor based in Asan-si, South Korea. He is known for his contributions to the field of semiconductor packaging. With a focus on innovative designs, Kim has made significant strides in enhancing the functionality and efficiency of semiconductor devices.

Latest Patents

Kim holds a patent for a semiconductor package that features a unique design. The package comprises a first die with a central region and a peripheral region, surrounded by a plurality of through electrodes. It includes first pads on the top surface of the first die, which are coupled to the through electrodes. A second die is placed on top of the first die, with second pads on its bottom surface. The design incorporates connection terminals that link the first pads to the second pads, along with a dielectric layer that fills the space between the two dies. Notably, the width of the first pads in the central region is greater than that in the peripheral region. The connection terminals feature convex portions that protrude beyond the lateral surfaces of the respective pads, enhancing the overall design.

Career Highlights

Seongyo Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to collaborate with other talented professionals in the field.

Collaborations

One of his notable coworkers is Un-Byoung Kang, with whom he has worked closely on various projects related to semiconductor technology.

Conclusion

Seongyo Kim's innovative approach to semiconductor packaging has positioned him as a key figure in the industry. His patent reflects a commitment to advancing technology and improving device performance.