Company Filing History:
Years Active: 2023-2025
Title: Innovations by Seonghwan Jeon in Semiconductor Technology
Introduction
Seonghwan Jeon is a notable inventor based in Osan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to semiconductor packaging.
Latest Patents
One of his latest patents involves a semiconductor package that includes a first semiconductor chip designed with a first semiconductor device and a first semiconductor substrate. This package features a plurality of through electrodes that penetrate the first semiconductor substrate, along with a number of first chip connection pads arranged on the upper surface of the substrate. Additionally, the design incorporates multiple second semiconductor chips that are sequentially stacked on the first semiconductor chip. Each of these second chips includes a second semiconductor substrate and a second semiconductor device controlled by the first semiconductor chip. The package also contains bonding wires that connect the first chip connection pads to the second chip connection pads, as well as external connection terminals located on the lower surface of the first semiconductor chip.
Career Highlights
Seonghwan Jeon is currently employed at Samsung Electronics Co., Ltd., where he continues to develop innovative semiconductor solutions. His work at Samsung has positioned him as a key player in advancing semiconductor technology.
Collaborations
He collaborates with talented coworkers, including Manho Lee and Eunseok Song, who contribute to his projects and innovations.
Conclusion
Seonghwan Jeon's contributions to semiconductor technology through his patents and work at Samsung Electronics Co., Ltd. highlight his role as an influential inventor in the industry. His innovative designs are paving the way for advancements in semiconductor packaging.