Location History:
- Yongin-Si, KR (2016 - 2020)
- Gyeonggi-do, KR (2022)
Company Filing History:
Years Active: 2016-2022
Title: Innovations of Seong Muk Lee
Introduction
Seong Muk Lee is a notable inventor based in Yongin-si, South Korea. He has made significant contributions to the field of automotive engineering, particularly through his innovative patents. With a total of 3 patents, Lee has demonstrated his expertise in developing advanced materials and mechanisms for vehicles.
Latest Patents
One of his latest patents is a thermosetting composite resin composition that boasts superior surface smoothness and mechanical properties. This invention includes a thermosetting resin, specifically an unsaturated polyester resin, along with a low-profile additive and an inorganic filler. The method of manufacturing automobile shell plates using this composite resin allows for the creation of lightweight components with enhanced durability. Additionally, Lee has developed a fuel door apparatus for vehicles, which features a rotatable fuel door connected to a door housing. This apparatus includes a locking lever and a restraining lever that work together to ensure secure operation of the fuel door.
Career Highlights
Throughout his career, Seong Muk Lee has worked with prominent companies in the automotive industry, including Hyundai Motor Company and Kia Motors Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.
Collaborations
Lee has collaborated with talented individuals such as Sang Sun Park and Se Yong Kim. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in the automotive sector.
Conclusion
Seong Muk Lee's contributions to automotive innovation through his patents and collaborations highlight his role as a key figure in the industry. His work continues to influence the design and functionality of vehicle components, showcasing the importance of innovation in engineering.